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Hydrogen Peroxide/Nitric Oxide Etch Solution

IP.com Disclosure Number: IPCOM000041710D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-02

Publishing Venue

IBM

Related People

Authors:
Greene, KF [+details]

Abstract

During an electroless nickel plating process, the plating rack also becomes nickel plated. It has been found that a hydrogen peroxide (H2O2) and nitric oxide (HNO3) solution provides superior etching of nickel without any deleterious side effects. Prior to this discovery, a 50% HNO2 solution (ΒΌ hour immersion at room temperature) was employed, with less than satisfactory results (i.e., variability and slow etch rate). Higher HNO3 solutions and higher operating temperatures increased harmful fuming. It was found that the addition of small quantities of H2O2 (which by itself is not a nickel etchant) to an HNO3 solution has a marked effect on the etch rate of nickel.