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Chip Salvage Head: Removes Good Chips From Bad Modules for Reuse

IP.com Disclosure Number: IPCOM000041891D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

Publishing Venue

IBM

Related People

Authors:
Bechard, RR Newbury, GE [+details]

Abstract

This article discloses a chip-removal tool for use in removing good chips from defective modules. The tool comprises a manifold 10 having a number of openings therein equal to the number of chips 11 to be removed from the substrate 12. The manifold 10 is positioned within a body 13. The body 13 is provided with internal stops 14 which prevent the manifold from being retracted more than a specified distance from the substrate. The body 13 is further provided with a substrate clamp 15 for holding the substrate 12 against the bottom of the body 13. A hollow bellows 16 is mounted over the chips a set distance and has its hollow interior connected to a vacuum line 17 and to the opening in the manifold 10.