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Mercury Connector Height Enhancement Technique

IP.com Disclosure Number: IPCOM000041892D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

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Purushothaman, S Zupicich, A [+details]


Greater height of mercury contacts may be achieved by the use of a silicon mask with anisotropically etched cavities, clamped in place over a circuit to be mercurized, and shimmed to a desired height, with the assembly evacuated for pressure mercurization. This causes the mercury to ball up higher than the expected height determined by the size of the wetted pad. Common methods of mercurization result in mercury heights determined by pad area and pitch. Some height enhancement can be achieved with increased pad sizes on the same pitch; however, the pad to pad variation in heights may become excessive. Further, increased pad sizes reduce the real estate available for wiring channels. The technique involves a prewetting assembly shown in the figure.