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Browse Prior Art Database

Composite Lamination Process

IP.com Disclosure Number: IPCOM000041939D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

Publishing Venue

IBM

Related People

Authors:
Varker, KJ [+details]

Abstract

Multilayer circuit boards generally consist of a plurality of composites which are bonded together utilizing sheets of prepreg. The bonding is affected utilizing high temperatures and high pressure. An improved circuit board can be fabricated utilizing low temperature, low pressure glue to bond composites together. The individual composites will be fabricated utilizing the normal type of prepreg resin. These will be laminated and cured when there is no important dimensional pattern involved. The required registration between composites can be maintained by utilizing a low temperature, low pressure glue to bond the composites together, thereby avoiding high temperature, high pressure lamination which might affect the dimensional stability of the composites when they are being bonded together.