Non-Contact Semiconductor Wafer Cleaning
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
This is a non-contact final cleaning technique for effectively removing polishing residues and other contaminants following the final polishing operation. It can replace the conventional contact or brush steps that normally use corrosive sodium hypochloride mixtures and detergents. In this process contaminated semiconductor wafers are immersed in RODELENE*, which is normally sold as an etch inhibitor. RODELENE consists of ethyleneglycol, hydrated silica, and aliphatic hydrocarbons. Preferably, the RODELENE liquid is exposed to megasonic agitation to more effectively clean the contaminant from the wafers. * Trademark of Rodel Company, Newark, Delaware.