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Method of Increasing Capacitance of Tap Capacitors Disclosure Number: IPCOM000041951D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

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Horstmann, RE Pratt, JD [+details]


A method is provided for increasing the capacitance of tab capacitors by vertical stacking. Capacitance may be increased by placing two or more capacitors in parallel, as shown in Fig. 1. In Fig. 2, low inductance capacitors can be "stacked" or "piggybacked" by providing the same footprint 11 on the top and bottom of capacitor 12. The method is accomplished by placing electrode tabs 13 on both top and bottom of the electrode pattern (not shown). Joining is accomplished by solder reflow, with stacking being achieved by successive reflow at each level using a lower temperature solder as each level is added.