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Module Seal Structure With Controlled Tolerance

IP.com Disclosure Number: IPCOM000042003D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

Publishing Venue

IBM

Related People

Authors:
Horvath, JL Lipschutz, LD [+details]

Abstract

In the direct sealed module described in [*], the relatively large tolerance variation between the top of the substrate and the module cap is accommodated by the slidable pistons that contact the backsides of the devices. However, the sealing structure, as illustrated, could not achieve the necessary tolerances between the backside of the devices and the opposed surfaces of the cap if the pistons were replaced with another form of heat-conduction means, for example, thermal grease or thin flexible metal-conduction elements. In this module-sealing arrangement the substrate 10 has both the top and bottom border surfaces 12 and 14 ground to a smooth finish. The top surface 12 is ground using the top surface of the substrate as a reference. The bottom surface 14 is ground using the bottom surface of the substrate as a reference.