Take Time Monitor
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03
One of the critical operations associated with electroless plating of printed circuit boards is the catalyzation, seeding, or activation of the surface on which the plating is to take place. An accurate technique for measuring the activity of colloidal seeding baths is required. The activity of such baths can be monitored by the use of an epoxy coupon which has two copper lines plated thereon. The copper lines would run the length of the coupon and they could, for example, be 2 to 3 centimeters apart. This coupon is placed in the seeder, and the resistance between the two lines is measured. The time required for a conductive path to be established between the two lines is a measure of the activity of the seeder bath.