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Browse Prior Art Database

Substrate for High Power Packaging

IP.com Disclosure Number: IPCOM000042156D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-03

Publishing Venue

IBM

Related People

Authors:
Vanderlee, KA [+details]

Abstract

This article describes a circuit substrate suitable for high temperature processing. The structure shown combines high thermal conductivity and coefficient of thermal expansion matching that of alumina, and the ability to withstand high manufacturing process temperatures. A significant cost and design advantage is provided by this structure which obviates some problems of heat transfer and mechanical integrity. The structure shown comprises a metal core 2 having an alumina or other ceramic coating 4 applied thereto by conventional techniques. Metal core 2 may be a single metal or a clad metal composite. In the figure, the core 2 is a clad metal composite consisting of a nickel alloy with a layer of copper 3 clad on either side.