Browse Prior Art Database

Multidimensional Transmission Line Package

IP.com Disclosure Number: IPCOM000042363D
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-03

Publishing Venue

IBM

Related People

Authors:
Yogi, T [+details]

Abstract

Configuring all wiring dimensions for a high speed, low temperature integrated circuit on the same level on an insulated ground plane provides good transmission line characteristics; where necessary, insulated jumpers are provided as crossovers. The net result has better transmission line characteristics than a package having a separate metallization level for each dimension. In package wiring where high speed and high density are required, it is important to control the impedance of the transmission lines with a good wiring yield. In Josephson packaging, where thin film levels are solely used for wiring, these requirements are particularly critical.