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Method for analyzing the super-fill capability of Cu electroplating additives

IP.com Disclosure Number: IPCOM000042377D
Publication Date: 2005-Feb-03

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for analyzing the super-fill capability of copper (Cu) electroplating (EP) additives. Benefits include improved functionality, improved throughput, an improved development environment, and improved cost effectiveness.