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Vibration Soldering Equipment

IP.com Disclosure Number: IPCOM000042625D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Backes, JL Johnson, E Trivedi, AK [+details]

Abstract

It has been demonstrated that the solderability of circuit boards is greatly improved when the board is mechanically vibrated. Both wave soldering and immersion soldering can benefit from this process. Plated through holes may not be soldered for a number of reasons. Surface tension may prevent solder from entering the hole, debris may plug the hole, or defects in the plating may stop solder from completely filling the hole. Vibrating the plate overcomes these problems for it (a) provides a dynamic force to drive solder into the holes, and (b) reduces the apparent surface tension of the solder (improves the wetting). A fixture for applying vibrations to the board is the subject of this article. Its applications are for immersion soldering or immersion wave soldering. Fig.