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Browse Prior Art Database

Method for Low Temperature Module Encapsulation

IP.com Disclosure Number: IPCOM000042650D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Bakos, P Funari, J Puterbaugh, LJ Rivenburgh, DL [+details]

Abstract

A method is proposed wherein a cap and a new solder composition are provided, which is especially suitable for module encapsulation. The cap is reusable and can be removed and reattached several times to allow repair and rework on the top surface of the module. It is known that organic sealants allow more gas permeation than metal-to-metal sealants. However, metal sealants require high temperature welding or brazing which can cause the devices in the module to change their electrical characteristics or they may be damaged. The present method provides an adequate metal-to-metal sealant which can be reused as many times as desired and which can be sealed at low temperature.