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Photolith Dry Film Resist Trimmer

IP.com Disclosure Number: IPCOM000042732D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Byrne, TM Christensen, RG Davis, C [+details]

Abstract

A RISTON* photoresist is introduced into a lift-off process by a lamination technique. Silicon wafers are laminated in a continuous row. See Fig. 1. A layer of RISTON is rolled on top of the silicon wafer, and a protective coat of MYLAR* rolled on top of the RISTON. A layer of MYLAR is also rolled on the bottom side of the silicon wafer. See Fig. 2. The laminated wafers are roughly cut from the strip with a pair of scissors or a sharp knife. The MYLAR-RISTON-MYLAR lamination will be trimmed off to the edge of the silicon wafer. There must be no residue on the edge of the silicon wafer that will affect the registration of the wafer in subsequent operations. To accomplish this, a dry film resist trimmer is used.