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Etched Silicon Integrated Circuit Heat Sink

IP.com Disclosure Number: IPCOM000042876D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Brady, MJ Comerford, LD [+details]

Abstract

The disclosed heat sink for ICs (integrated circuits) is fabricated from single crystal silicon and can be batch processed and directly attached to the substrate side of a flip-chip silicon IC. The heat sink 1 is fabricated by etching V-shaped grooves 2 in a single crystal silicon plate 3. The grooves form a continuous path with ports 4 and 5 at each end. Ports 4 and 5 can be ultrasonically machined, anisotropically etched, or laser etched. In operation, the grooved side of silicon plate is bonded to the substrate side of a flip-chip silicon IC and provision is made for attaching a forced coolant source (not shown), to entrance port 4. The coolant flows along the grooved path and is discharged through exit port 5. Several single crystal silicon plates may be stacked to increase the cooling capacity.