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Phenylacetylene Resins As Laminates for Printed Circuit Boards

IP.com Disclosure Number: IPCOM000042973D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Cheng, YY Cox, RJ Jones, CR [+details]

Abstract

A class of thermosetting resins, prepared from triethynyl benzene, diethynyl phenylether and phenylacetylene, called ATP resins has been found useful as a glass-filled composite which can be laminated and used for the fabrication of printed circuit boards. The structure of this resin is a highly crosslinked complex structure produced by the coupling of free ethynyl groups. It is prepared by the following series of reactions: This partially polymerized product can be thermally crosslinked to an insoluble infusable polymer.