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Thick Film Wire Bond Process

IP.com Disclosure Number: IPCOM000043030D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Lanpher, DA Sullivan, JF [+details]

Abstract

This article describes a technique for joining wires on substrates for rework, engineering changes or repairs. The process is an alternative to conventional wire bonding or micro surface welding. The complete process includes four steps as follows: Step 1. A dot of copper paste, such as du Pont #4347 or equivalent, is placed on a via, pad or tab. Step 2. A one-mil Au wire is placed on the Cu paste dots. Step 3. The Cu paste is dried at 120 C either in air or nitrogen. Step 4. The Cu paste is fired for 10 minutes in a nitrogen atmosphere at 6050C. Laser curing of the copper is also possible. The paste will diffuse together and into the ceramic or pad, and the one-mil wire will remain in the copper pad.