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Bonding Registered Assemblies

IP.com Disclosure Number: IPCOM000043096D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Hatchett, MR Vaughan, EV [+details]

Abstract

A bonding technique is described for a recording head. An adhesive is used which cures slowly with an activator and quickly when exposed to ultraviolet (UV) light. After the parts to be bonded have been precisely registered in a jig with the adhesive in place, the visible portion of the adhesive is cured quickly by exposure to UV light. This secures the parts temporarily, allowing the jig to be removed while the remainder of the adhesive completes curing slowly. The diagram shows a ceramic post to be bonded to an aluminum arm during manufacture of a recording head. The steps in the bonding technique follow: 1. The mating surfaces of the post and arm are coated with an activator by spraying, dipping or other suitable coating method, and the activator is allowed to dry. 2.