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Cleaning of Line Channels With Plasma

IP.com Disclosure Number: IPCOM000043165D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Agostino, PA Welsh, JA [+details]

Abstract

A portion of the manufacturing process of a multilayer printed circuit board consists of laminating a copper clad epoxy board with a dry film photoresist, exposing that photoresist to a light source through a photomask, and developing the latent image. Before the board is copper plated, it is treated to plasma etching, between power levels of 1 kW and 3.5 kW in an atmosphere between 70% O2/30% CF4 and 90% O2/10% CF4 . The resulting plated pattern contains less defects than boards processed without plasma treatment.