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Module System Refrigeration Concept Disclosure Number: IPCOM000043211D
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04

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Chan, JY Dunn, RM Plucinski, MD Rathod, MS Stutzman, RJ [+details]


The Module System Refrigeration (MSR) concept uses the thermodynamic properties of refrigerants to remove heat from a high power density heat source (HPDHS) by a Direct Expansion Module (DXM) and to reject the heat to the ambient air. The unique characteristics of the MSR concept are the DXM and its precision controls. The compressor 1 raises the pressure of the refrigerant to a high enough value such that the condenser operating temperature is higher than the ambient. At the condenser 2, the refrigerant changes phase from vapor to liquid by rejecting heat received from the HPDHSs into the ambient air. The high pressure and temperature liquid refrigerant from the condenser enters the expansion devices 3 and expands in two stages to a low pressure, first in the expansion devices and then in the DXMs 4.