Large Format Substrate Concept
Original Publication Date: 1984-Jul-01
Included in the Prior Art Database: 2005-Feb-04
A one-piece upper substrate 5 with recessed solder sockets 6 is utilized to prevent pinning problems normally associated with providing electrical connections through ceramic bases. A double sided pinning process with a "B" length pin matrix 1 on the topside of the substrate and a "C" length pin matrix 2 on the bottom electrically connects the upper substrate 5 to the printed circuit board through the multiple substrates 3 and 4. The recessed solder sockets 6 provide the connection of upper substrate 5 to the pins.