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Separable, Conformal, Low Profile Connector Means

IP.com Disclosure Number: IPCOM000043281D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04

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Related People

Ecker, ME [+details]


Presently, interconnection systems for components are accomplished by soldering component pins into plated-through-holes, or inserting into spring contact connectors. There is a movement in the industry to utilize surface contact and solderable components. This article provides a low profile, tri-axial compensation connection with trifurcated wiping action for pinless component interconnection. An embodiment is shown in Fig. 1. An array of copper balls or bumps is disposed on the underside of the substrate and a flex cable system. In the case of copper balls (gold plated), the balls are attached as follows: 1. A suitable solder, or gold epoxy, is screened onto the pad array on the underside of the module (component). 2.