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Wafer-Aligning Feature for a Wafer-Lifting Device

IP.com Disclosure Number: IPCOM000043311D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04

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Miklos, MJ Rahaim, PT [+details]


This invention eliminates the need for separate pick-up and deposit wafer-handling devices. At the present time, automated wafer-handling equipment uses Bernoulli air flow wafer-lifting devices to remove or deposit wafers from or into recessed pockets in machines, such as sputtering equipment anodes. The geometry of clearances and given tolerances of both the tools and the wafers at the present time require two different diameters within which the transported wafers must align. Thus, these two different diameters result in a need for two different pick-up tools. The wafer-aligning diameter or deposit device diameter must be smaller than the diameter of the recessed pocket into which it is to be inserted.