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Browse Prior Art Database

Encapsulated Wire Joint Bond Test

IP.com Disclosure Number: IPCOM000043369D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Underkofler, WL Wilcox, JR [+details]

Abstract

A test to measure the integrity of a wire to copper plate joint in a wire-encapsulated circuit board is accomplished by the following method: A wire to plated through-hole joint is duplicated in a small test panel (Fig. 1) that consists of several board subassemblies that are laminated together. One of the subassemblies 2 is wired with a series of parallel wires 3, while the other subassemblies 4 have no wires. Sectioning the test panel perpendicular to the wires and grinding the edge flat exposes a series of wire ends 5 for plating. The test panels are mounted to a frame and then subjected to hole cleaning, seeding and plating procedures. The copper plate 6 on the test panel edge is peeled to separate the wire to copper plate joint (Fig. 2).