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Hermetic Seal for Semiconductor Package Disclosure Number: IPCOM000043377D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue


Related People

Olah, WW Zykoff, FB [+details]


This elastomer seal, between the cap and a surface on a ceramic substrate of a semiconductor package, is capable of containing helium gas within the chamber. Referring now to the figure, a chamber 10 is formed between the cap 12 and the ceramic substrate 14. In practice, the module will have devices (not shown) bonded to the top surface of substrate 14 and cooling structure within or mounted on cap 12. The edge or peripheral area of the substrate 14 is preferably ground to a smooth surface on both sides as indicated by the recessed portion. An annular seal 16 of cured or uncured elastomer material cut in the form of a gasket is deposited on the ground surface of the substrate and clamped between the abutting surface 18 of cap 12. The seal material of gasket 16 is preferably epichlorylhydrin in the cured or volcanized state.