Method and Apparatus for Elongating Semiconductor Solder Joints
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-04
In this apparatus the active element that elongates the solder joints is automatically initiated by the heating environment used to reflow the solder pads. The apparatus 10 has a yoke 12 with apertures 14 located directly over devices 16 that are to be joined to pads on substrate 18. Mounted in each aperture 14 is a split rivet-like element 20 provided with a central aperture. Elements 20 are free to slide up and down in apertures 14. Mechanical clips 22 hold the bifurcated portions of element 20 together to make the element freely slideable. A cover 24 over yoke 12 is connected to a source of vacuum, thereby forming a vacuum plenum. In order to elongate the solder terminals 26, shims 28 are placed over devices 16 that have previously been located on the substrate.