Browse Prior Art Database

Heat Sink for Thermal Conduction Module

IP.com Disclosure Number: IPCOM000043462D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Gruber, H Stadler, EE Stahl, R [+details]

Abstract

An inexpensive method is described of generating a heat sink for thermal conduction modules (TCMs), wherein aluminum plates, provided with spacers, are electrowelded to each other to form a heat sink, through which cooling air is blown. The aluminum plates may be contoured or have ribs to prevent a whistling effect between the aluminum plates. The method is described below with reference to the figure. Aluminum plates 1, having a thickness of 1 mm, are bent at two facing edges. The bent portions 2, 3 serve as spacers. A number of aluminum plates thus treated are stacked and interconnected along the spacer edges by electrowelding in a protective gas atmosphere. The face of the heat sink, that is placed on the TCM and that is increased by having four aluminum ribs 4 welded to it, is subsequently ground.