Coating Photoresist Directly Onto Printed Circuit Board Substrates
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04
The film photoresist used to fabricate circuit boards is fabricated by coating photoresist onto a carrier such as MYLAR*. The combined sheet of MYLAR and photoresist is then laminated onto a circuit board substrate. It is noted that lamination of photoresist onto a circuit board substrate is inherently a slow operation, whereas coating photoresist onto a substrate is a very fast operation. An improved process for making circuit boards and an improved circuit board can be achieved by coating photoresist directly onto a circuit board substrate. The circuit board substrate could consist of thermoplastic materials, such as polyetherimide, such as ULTEM** or polysolfone, such as UDEL***.