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Coating Photoresist Directly Onto Printed Circuit Board Substrates Disclosure Number: IPCOM000043505D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04

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Related People

Stephanie, JG Welsh, JA [+details]


The film photoresist used to fabricate circuit boards is fabricated by coating photoresist onto a carrier such as MYLAR*. The combined sheet of MYLAR and photoresist is then laminated onto a circuit board substrate. It is noted that lamination of photoresist onto a circuit board substrate is inherently a slow operation, whereas coating photoresist onto a substrate is a very fast operation. An improved process for making circuit boards and an improved circuit board can be achieved by coating photoresist directly onto a circuit board substrate. The circuit board substrate could consist of thermoplastic materials, such as polyetherimide, such as ULTEM** or polysolfone, such as UDEL***.