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Etch Gas Distribution Manifold for Plasma Reactor

IP.com Disclosure Number: IPCOM000043512D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-04

Publishing Venue

IBM

Related People

Authors:
Bui, VQ Suryadevara, BV Welsh, JA [+details]

Abstract

Non-uniform etch rates for plasma desmearing of throughholes in printed circuit boards that are caused by a non-uniform flow pattern can be corrected by the addition of a multi-holed distribution manifold 1 to the gas inlet 2. A typical configuration (Fig. 1) is improved upon (Fig. 2) by using various hole and manifold diameters, arrangements and configurations to distribute the entering gases 2 uniformly in the reactor 3.