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Non-Epoxide Containing Epoxy Resins for Rigid Disk Applications

IP.com Disclosure Number: IPCOM000043601D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Balanson, RD Dawson, D Oxsen, ME [+details]

Abstract

Epoxy resins have been used for numerous applications from circuit boards (glass reinforced epoxys) to adhesives. The typical structure of an epoxy resin (the oligomer formed from bisphenol A and epichlorohydrin) is shown below. The terminal groups of this resin are EPOXIDE moieties. (Image Omitted) The chemical reactivity of the epoxide group is quite high when compared to the secondary alcohols found within the chain of the polymer. Depending upon the molecular weight of a particular epoxy resin, the number of epoxy groups per unit weight will vary, commonly expressed in terms of the Epoxide Equivalent Weight (EEW). It has been found that the epoxide group is unstable to conditions commonly encountered during pigment/polymer dispersion processing.