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Laminating Resin Compositions

IP.com Disclosure Number: IPCOM000043762D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Brock, PJ Cox, RJ [+details]

Abstract

We have prepared a class of acetylene-terminated resins with the general formula (Image Omitted) where R is an aryl group. These resins are readily prepared in a one-step reaction, as shown below: (Image Omitted) Specific examples of such compounds are: (Image Omitted) We have found that these two compounds when mixed in a 1:1 ratio by weight form a viscous syrup which can be used as a thermosetting resin. Resins of this sort are useful for fabrication of printed circuit boards, and when imbibed in a glass cloth matrix and heated in air at 130ŒC for several minutes form a non-tacky prepreg. Several layers of this prepreg can be laminated by heating under pressure at 250ŒC for at least an hour to form a hard highly crosslinked composite which is thermally stable.