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Browse Prior Art Database

High Density Memory Package

IP.com Disclosure Number: IPCOM000043814D
Original Publication Date: 1984-Sep-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Kerjilian, GK Stadler, EE Stahl, R Straehle, W [+details]

Abstract

Hermetically sealed and densely packed chips or modules 1 can be effectively cooled, irrespective of their mechanical relationship, if they are mounted on a flexible circuit 2. This flexible circuit is placed around a foam rubber mat 3, so that the chips are arranged on either side (Fig. 1). The package is transferred to a metal housing 4, by which mat 3 is compressed. As a result, the chips are pressed against metal housing 4 for heat discharge. The two ends of the flexible circuit are linked with a connector 5, positioned on the left hand side of metal housing 4 and serving to plug the circuitry package into a socket of another card or board. It is also possible to replace the flexible circuit loop by two flexible circuits 2a, 2b (Fig.