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Subsurface Circuitry on Polymeric Substrates Disclosure Number: IPCOM000043948D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05

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Mace, EW [+details]


This technique represents a novel, efficient, low-cost, high-production method of fabricating electronic circuits, by featuring polymer thick-film circuitry on an unreinforced or reinforced polymer substrate. The process is amenable to high speed reproducible circuit manufacture. Present methods of preparing circuits for electronic and electrical devices typically involve processes such as subtractive etching of metal films, additive plating of metallic films, wire embedment, conductive inks, screened-on conductive pastes, and other procedures which commonly require blanking, routing, drilling, plating, etching, and related activities. Artwork is also usually required, as well as photo or silk-screen processes. Furthermore, substrates used tend to be expensive.