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Method for Determining the Percent of Tin in High Lead Solder

IP.com Disclosure Number: IPCOM000043966D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Ameen, JG Veeraraghavan, VG [+details]

Abstract

A method for determining the percent of tin in high lead solder has been defined using the difference between the solidus and liquidus temperatures of the binary tin/lead phase diagram. Described herein is a concept which is useful in the composition range, where the temperature difference between the solidus and liquidus states is a monotonic function of composition and not limited to trace levels of impurity. The method employs differential scanning colorimetry (DSC) to determine this difference temperature. The differential scanning calorimeter is a machine that is used to study the thermal properties of material. There is a built-in program that determines the purity of compounds from their freezing point depression.