Pin Repair Using Ultrasonic Aluminum Bonding
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05
This article describes a process for repairing pulled ceramic pin sites on multilayer ceramic substrates having ceramic pull-out due to pin repair damage. The disclosed process, which is fast and reliable, permits the reclamation of such substrates under room temperature conditions with no ceramic damage. A certain percentage of production TCM substrates is discarded because of ceramic pull-out under an I/O (input/output) pad. A typical cross-section of such a substrate in the vicinity of the damaged I/O pad (including vias) is shown in Fig. 1. Aluminum metal will directly bond to a variety of ceramic surfaces with adhesion strengths approaching 10 kpsi in tension. Such bonds can be made at room temperature using an ultrasonic compression mechanism.