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Reactive Gas Mixtures for Plasma Hole Cleaning

IP.com Disclosure Number: IPCOM000044063D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Bui, VQ Hoffarth, JG Suryadevara, B [+details]

Abstract

Plasma cleaning of through holes has been carried out using CF4 + O2 mixtures of different compositions. The fluorine-containing radicals initiate the break-up while oxygen scavenges the carbon and hydrogen, exposing new material for the fluorine-containing radicals. The glass pieces embedded in the hole walls cannot be completely removed by this particular combination of gases due to the non-volatile nature of the products of the etching of aluminum present in the fibers. Mixtures of O2 or O2 + Ar with NF3, CClF3, CCl2F2 and other fluoro chloro hydrocarbon and chlorine-containing gases are preferred for aluminum substrates. Obviously, care must be exercised with aluminum reactors. NF3 should be excellent because of the following reasons: 1. It contains no carbon, but still has 3 fluorine atoms for each molecule. 2.