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Self-Adjusting Soldering Fixture

IP.com Disclosure Number: IPCOM000044067D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Margets, JG Tatko, HR [+details]

Abstract

A special fixture is needed to satisfy a printed circuit board requiring two distinct soldering processes. During the first process, the tri-lead pin, ground rail and power pins are soldered in the normal fashion. The second process uses a solder pump with a specially designed chimney built to accommodate a 21 x 42 matrix of pins (harcons) on a staggered 1.25 mm grid. A bowing occurs, however, at the harcon solder site because of the localized heat transmitted to the board site and because of the thin board cross-section. A self-adjusting soldering fixture is designed to accommodate board bowing during the solder process to attain a constant pin-to-board distance. The harcons 11 are attached to a selvage strip 12.