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Universal Electronic Package

IP.com Disclosure Number: IPCOM000044136D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05

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Goldmann, LS [+details]


This packaging concept allows flexibility in design, low cost and reparability. It involves mechanical stacking of thin ceramic sublayers and interconnection by thin copper "hat pins". This substrate 10 is made up of a plurality of layers 12, 14, 16 and 18. The layers can be made of (1) pressed ceramic with thin or thick film metallization on one side or both, (2) pressed ceramic with added metal-glass or polyimide metal layers, and (3) multilayer ceramic substrates, or any combination thereof. Semiconductor chips 20, discrete components 22 and/or wires may be bonded to the top or bottom of any layer. Alignment and mechanical support for the various layers are provided by a stacking mechanism remote from the active substrate area, such as protrusions 24 that fit into aligned depressions 26.