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Plasma Smoothing Small Drilled Holes in Polymer Test Heads

IP.com Disclosure Number: IPCOM000044168D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Lo, JC Lu, N [+details]

Abstract

Selective plasma etching of the small drilled holes (less than 5 mils) for substrate electrical test head component, provides smooth wall surfaces for the buckling beam placement and allows the buckling beam probes to move freely through these holes. Buckling beam probes 11 slide back and forth through the 5-mil (or less) drilled holes of the dies 12, 13, and 14 and the isolator 15. In order to transmit the contact force to the chip/substrate joints the probe must move freely through these holes. The drilled holes, therefore, must be free of burrs, smear and uneveness.