In Situ Stress Measurement
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05
The mechanism shown above provides detection for overstress (shock-vibration) of a substrate or module. Handling in fabrication, shipment or installation can produce electrical malfunction due to stress-induced damage if the stresses are large enough in magnitude. By providing an electrical circuit that is built into a module in an area which would be expected to be damaged by shock-vibration stresses, the device can be tuned to react at a level of stress which signals the onset of damage to the functional operation of the module. In this way, system malfunction can be prevented, and the reliability objectives can be maintained. Fig. 1 shows the general physical layout of the measurement device.