Browse Prior Art Database

Fabrication of Thin Film Head

IP.com Disclosure Number: IPCOM000044205D
Original Publication Date: 1984-Nov-01
Included in the Prior Art Database: 2005-Feb-05

Publishing Venue

IBM

Related People

Authors:
Church, MA [+details]

Abstract

A process for fabricating a thin film head includes the steps of depositing a thin film pole piece layer 1 on a substrate, depositing an insulating gap layer 2 on the pole piece layer; and depositing a thin film chromium protective layer 3 on the gap layer to serve as an isolation layer, as in Fig. 1. As shown in Fig. 2, a resist insulation layer 4 is deposited, exposed, developed and baked; and an etch resist material 5 is exposed and developed. The back gap vias 6 are etched to first break through the isolation layer, then the gap layer. A copper coil 7 is produced on insulation layer 4 by a means of photolithography and plating on a chromium-copper seed layer 8 which has partially replaced the isolation layer, as in Fig. 3.