Surface-Mounted Array-Type Plastic Chip Carrier
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-05
Commonly available array-type chip packages typically provide peripheral accessibility and thus have somewhat limited input/output density. This article presents a novel design for high density, low cost array chip packaging for surface-mounted devices. Typically, I/O accessibility in semiconductor devices has been provided on the periphery of the package containing the given device. Because of this peripheral design, the I/O density of such devices -- i.e., the number of signals handled in and out -- has been limited to relatively low levels. The present package design (Figs. 1, 2, 3) provides a solution to this density limitation through the incorporation of an array format technique.