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Lift-off Processes with Improved Step Coverage

IP.com Disclosure Number: IPCOM000044695D
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Dinklage, JB Luther, BJ [+details]

Abstract

A technique for improving the step coverage of metal lift-off processes. It involves using a blanket metal film on the wafer before the formation of the photoresist mask. This provides a good base film uniformity covering all topography and establishing a surface for nucleation of the subsequent evaporated metal.