Lift-off Processes with Improved Step Coverage
Original Publication Date: 1984-Mar-01
Included in the Prior Art Database: 2005-Feb-06
A technique for improving the step coverage of metal lift-off processes. It involves using a blanket metal film on the wafer before the formation of the photoresist mask. This provides a good base film uniformity covering all topography and establishing a surface for nucleation of the subsequent evaporated metal.