Monitor System for Electromigration Extrusion Detection
Original Publication Date: 1984-May-01
Included in the Prior Art Database: 2005-Feb-06
This monitor system detects the presence and time of initiation of electromigration induced extrusions during long term high current stress testing of metal stripes on integrated circuit (IC) chips. Previously only open circuit fails were recorded. In order to detect extrusion fails (which can cause short circuits in IC's), a dead end sample monitor stripe is located adjacent to the sample stress stripe at minimum ground rule spacing. The monitor stripe is wired up as shown in the Figure.