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An Image Reversible Positive Photoresist with Chemically Induced High Temperature Rheological Stability

IP.com Disclosure Number: IPCOM000044736D
Original Publication Date: 1984-Jun-01
Included in the Prior Art Database: 2005-Feb-06

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Bergeron, RJ Linde, HG Lowen, CS Poley, DJ [+details]


This teaches a chemical process in which previously unstable photoresist structures can be converted into thermally stable images through the use of a special dual purpose cross-linking agent. The dual purpose cross-linking agent is an amine and is used to both form and cross link novolac photoresist structures, rendering them thermally stable. This method is especially useful for high temperature metal deposition techniques.