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Edge Connected Capacitors for Enhanced Multilayer Ceramic Packages

IP.com Disclosure Number: IPCOM000044780D
Original Publication Date: 1984-Aug-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Kraus, CJ Sahni, O Srikrishnan, KV Stoller, HI [+details]

Abstract

Decoupling capacitors are used to improve performance in high speed modules. In certain packages, they are C4-joined along with the logic chips to the substrate. The technique of connecting such capacitors edge wise (as contrasted to area wise) saves the substrate real estate, which is at a premium, from being used up by logic chips and EC pads, etc.