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Package for Semiconductor Chips and Photodiode to be Connected to Optical Fiber

IP.com Disclosure Number: IPCOM000044832D
Original Publication Date: 1984-Oct-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Boerstler, DW Johnson, AH [+details]

Abstract

A circuit package for optical and electrical components has alternating layers of metal and ceramic. A full layer forms the package base which carries internal wiring and supports conventional plug in connectors. Subsequent layers of metal and ceramic have openings that form a first cavity for optical components and a second cavity for semiconductor chips. A hole is provided in one end of the metal-ceramic structure for admitting an optical fiber to the first cavity for coupling to a photodiode. A metal cover seals the package. These components provide good electromagnetic shielding for both cavities.