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Soldering Method using Changes in Soldering Iron Temperature to Signal Steps in Process

IP.com Disclosure Number: IPCOM000044884D
Original Publication Date: 1984-Dec-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Goldfarb, SM [+details]

Abstract

Soldering is performed with a standard solder iron which contains a temperature sensor. Thermal data is used to signal that the iron has reached proper operating temperature to begin soldering. It is also used to detect a drop in temperature and rate of change of the temperature drop when the heated iron touches a component to be soldered. Massive joints requiring long heat-up times cause gradual asymptotic temperature drops, and are sufficiently hot when the temperature levels off. Less massive joints which cause a rapid temperature drop followed by a rapid increase are properly heated when the temperature begins increasing. These methods eliminate the need to determine specific heat-up times for individual solder joints. The soldering process is controlled by monitoring both asymptotic and rapid temperature drops.