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Browse Prior Art Database

Removing Solvent

IP.com Disclosure Number: IPCOM000044904D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

Publishing Venue

IBM

Related People

Authors:
Zeccardi, A [+details]

Abstract

In device manufacture all residual solvent should be removed from organics prior to the application of subsequent layers of the device. Present processes bake the organic layer to high temperatures to remove organic solvents, but also remove hydrogen-bonded water which increases the time needed for polysulfone removal. Baking at a lower temperature in a tube furnace will leave the hydrogen-bonded water, but will not remove all of the solvent. A better solution is to vacuum bake (250 degrees C; 1500 microns; 1-1/2 hours) the organics prior to the application of the next layer. This will remove all residual solvent and leave the hydrogen-bonded water.