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Improved Solder Pads

IP.com Disclosure Number: IPCOM000044905D
Original Publication Date: 1983-Jan-01
Included in the Prior Art Database: 2005-Feb-06

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Related People

Carpenter, C Curry, WJ Grosewald, P Mancaruso, F Mancey, S [+details]


This process eliminates storage/corrosion problems associated with lead surfaces and solder flux joining problems arising from flux removal (chemical treatment of solvents, stack reactants) and from variables of flux-joining process.